Analisis Kegagalan Material Kabel Heating Rod Tamper pada Asphalt Finisher BOMAG BF800C
Abstract
Kabel heating rod pada Asphalt Finisher BOMAG BF800C menstabilkan suhu pemadat selama proses pemadatan aspal. Kabel ini dapat menahan suhu hingga ±200 °C dan guncangan mekanis. Kondisi ini berpotensi menyebabkan kerusakan material dan malfungsi kabel. Tujuan dari penelitian ini adalah untuk membandingkan karakteristik mekanik dan listrik dari kabel heating rod yang baru dan yang rusak guna menentukan proses terjadinya kerusakan. Beberapa metodologi penelitian yang digunakan termasuk pengujian tarik, pengujian kekerasan mikro Vickers, dan pengujian resistansi listrik. Hasil pengujian tarik menunjukkan penurunan kekuatan tarik dan elongation pada kabel yang rusak, sementara pengujian kekerasan mikro Vickers menunjukkan perubahan nilai kekerasan material. Pengujian tahanan listrik pada kabel yang rusak menunjukkan nilai tahanan tak terhingga (OL), yang mengindikasikan adanya konduktor yang putus. Temuan studi ini menunjukkan bahwa kerusakan kabel heating rod disebabkan oleh degradasi material akibat siklus termal dan stres mekanis yang sering terjadi selama operasi. Studi ini dirancang untuk memberikan dasar teknologi bagi upaya meningkatkan keandalan sistem pemanas Asphalt Finisher.
Downloads
References
Abdualla, H., Ceylan, H., Kim, S., & Taylor, P. C. (2020). Design and thermal analysis of electrically conductive heated pavement systems. Transportation Research Record, 2674(11), 343–357. Washington, DC: National Academies of Sciences, Engineering, and Medicine.
Cartolano, M., Xia, B., Miriyev, A., & Lipson, H. (2019). Conductive fabric heaters for heat-activated soft actuators. Actuators, 8(1), 9.
Costa, E. R., Araújo, J. A., Veloso, L., Silva, C. R. M., & Ferreira, J. L. A. (2020). Development of controlled heating for fatigue test in overhead conductors at high temperature. Journal of the Brazilian Society of Mechanical Sciences and Engineering, 42(7), 385.
Czerny, B., Lederer, M., Nagl, B., Trnka, A., Khatibi, G., & Thoben, M. (2012). Thermo-mechanical analysis of bonding wires in IGBT modules under operating conditions. Microelectronics Reliability, 52(9–10), 2353–2357.
Hamdan, M. A. (2019). Analysis of thermo-mechanical stresses in joints and cables. University of Southampton.
Hassan, S., Rajaguru, P., Stoyanov, S., & Bailey, C. (2022). Towards electro-thermo-mechanical lifetime assessment for arbitrary power electronics. Microelectronics Reliability, 133, 114544. https://doi.org/10.1016/j.microrel.2022.114544
Khanna, V. K. (2023). Extreme-temperature and harsh-environment electronics: Physics, technology and applications. IOP Publishing.
Li, C., Zhang, Y., Hou, J., & Wei, L. (2024). Dynamic fatigue damage behaviors and mechanisms of overhead transmission Al wires at elevated temperatures. International Journal of Fatigue, 187, 108469. https://doi.org/10.1016/j.ijfatigue.2024.108469
Moerman, F., & Partington, E. (2014). Materials of construction for food processing equipment and services: Requirements, strengths and weaknesses.
Nwanoro, K. C., Lu, H., Yin, C., & Bailey, C. (2022). Analysis of IGBT wire bonds failure using extended finite element method. Engineering Failure Analysis, 138, 106318. https://doi.org/10.2139/ssrn.4108224
Salih, T. W. M. (2021). Insulation materials: Fundamentals and applications. Book, 21, 119–154.
Schroeder, M., Vogel, H., Wunderle, B., & Naumann, F. (2022). Highly accelerated mechanical lifetime testing for wire bonds in power electronics. Journal of Microelectronics and Electronic Packaging, 19(2), 47–58. https://doi.org/10.4071/imaps.1845316
Shen, Z., Yin, C., & Lu, H. (2022). Wire bond degradation under thermo- and pure mechanical loading. Microelectronics Reliability, 134, 114585. https://doi.org/10.1016/j.microrel.2017.08.011
Tisdell, E. J., Merriam, S. B., & Stuckey-Peyrot, H. L. (2025). Qualitative research: A guide to design and implementation. John Wiley & Sons.
Treyssède, F. (2018). Finite element modeling of temperature load effects on the vibration of local modes in multi-cable structures. Journal of Sound and Vibration, 413, 191–204.
Wang, Y., Liu, J., Chen, H., & Zhang, X. (2024). Online recognition of fallen-off bond wires in IGBT modules. Sensors, 24(4), 1152. https://doi.org/10.3390/s24041152
Zai, B. A., Khan, M. A., Khan, K. A., & Mansoor, A. (2020). A novel approach for damage quantification using the dynamic response of a metallic beam under thermo-mechanical loads. Journal of Sound and Vibration, 469, 115134.
Zhan, C., Zhu, L., Iannuzzo, F., Zhang, Y., Li, J., & Ji, S. (2024). Thermal effect on sinusoidal vibration fatigue of bond wire in IGBT gate loop. IEEE Journal of Emerging and Selected Topics in Power Electronics.
Zhou, Y., Gao, J., Zhang, T., & Lei, J. (2025). Thermal behavior of plated electrical connectors under high-power and high-frequency excitation. Electronics, 14(12), 2353.
Zhou, Y., Wang, Y., Su, S., Zhao, L., Zhao, M., Yuan, Y., Zang, J., Lu, J., Xu, X., & Zhang, P. (2023). Rapid grinding diamond film using a grinding wheel containing nickel-plated diamond abrasives based on mechanochemical effect. Diamond and Related Materials, 139, 110389.
Copyright (c) 2026 Andrean Mosa Putra Hidayat, Margono Sugeng

This work is licensed under a Creative Commons Attribution-ShareAlike 4.0 International License.








